Filed under: iPhone
3G iPhone under the hood
A while back we noted that iFixit had completely broken down a 3G iPhone to see what was inside. Now TechOnline has a report about exactly what makes it tick and they've managed to identify all the important chips on the iPhone's mainboard to get some insight into Apple's design choices.
They note that the 3G iPhone is an incremental improvement over the original iPhone rather than a ground up redesign. Of particular interest is how many of the new wireless parts are from Infineon, while the main processor remains a Samsung part. Strangely, given Apple's huge flash order with Samsung, the memory itself seems to be from Toshiba. Check out the original article for a fuller description of the new iPhone's silicon underpinnings. There are also some videos of the teardown.
[via MacNN]
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Reader Comments (Page 1 of 1)
Angel Rodriguez said 10:11AM on 7-15-2008
I hope this makes it into the rumored new MacBook Pro, along with the already announced multicore optimized future release of "Snow Leopard"
An Apple fan-boy can only hope... lol
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Rich UK said 11:38AM on 7-15-2008
you hope a 3g iphone board makes it into a MBP?
Angel said 12:00PM on 7-15-2008
It happens when u got 2 TUAW tabs open and you comment in the wrong one!
mason said 8:49PM on 7-16-2008
Is it possible that the huge Samsung order corresponds with a September (the month when the classic, nano, and touch will probably be upgraded as per normal apple procedure) change over in memory size? As in, at the same iPod announcement, el jobso will announce that iPhone memory will be bumped to 16-32GB for the same price points as the current 8-16GB iPhone 3G? That would explain why we're hearing about it NOW and not 3 months ago...
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